- All sections
- H - Electricity
- H01R - Electrically-conductive connections; structural associations of a plurality of mutually-insulated electrical connecting elements; coupling devices; current collectors
- H01R 12/57 - Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
Patent holdings for IPC class H01R 12/57
Total number of patents in this class: 882
10-year publication summary
69
|
67
|
66
|
115
|
113
|
95
|
95
|
72
|
63
|
20
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Japan Aviation Electronics Industry, Limited | 1585 |
40 |
Foxconn Interconnect Technology Limited | 1034 |
35 |
Molex, LLC | 1792 |
34 |
Lotes Co., Ltd. | 346 |
29 |
Sumitomo Wiring Systems, Ltd. | 9367 |
25 |
Sumitomo Electric Industries, Ltd. | 14131 |
19 |
Samsung Electronics Co., Ltd. | 131630 |
18 |
TE Connectivity Solutions GmbH | 2580 |
17 |
Tyco Electronics (shanghai) Co. Ltd. | 759 |
15 |
Robert Bosch GmbH | 40953 |
14 |
Yazaki Corporation | 6282 |
14 |
AutoNetworks Technologies, Ltd. | 5809 |
13 |
Kitagawa Industries Co., Ltd. | 205 |
13 |
Saint-Gobain Glass France | 3641 |
13 |
Apple Inc. | 50209 |
11 |
Murata Manufacturing Co., Ltd. | 22355 |
11 |
Phoenix Contact GmbH & Co. KG | 2202 |
11 |
Intel Corporation | 45621 |
10 |
Kyocera Corporation | 12735 |
10 |
Advanced Connectek Inc. | 338 |
10 |
Other owners | 520 |